Galvanotest2000 3000电解膜厚仪设备技术规格书设备技术规格书
Equipment Technical Specification
设备名称:Galvanotest2000 3000电解膜厚仪设备技术规格书 库仑测厚仪
Equipment name: Plating thickness tester
型号/Model:Galvanotest 3000
厂家及产地/ Manufacturer and Production Place:德国EPK/ ElektroPhysik
Galvanotest2000 3000电解膜厚仪设备技术规格书主要技术参数/Main technical requirements:
1. 测量范围/Measure range: 0.05μm到75μm
2. 准确测量电镀件(铜、镍、铬等)各层厚度/Accurately measure the plating thickness(Cu/Ni/Cr);
3. 测量面积/Measuring area: B: 4mm2 (直径2.26mm) C: 1mm2 (直径1.13mm) D: 0.25mm2 (直径0.56mm) K: 电解杯(为测量小部件和导线用)
4. 测量不确定性 /Measuring uncertainty:
4mm2测量面积:± (%读值)
1mm2测量面积:± (%读值)
0.25mm2测量面积:± (%读值)
如果没有标准板,可认为UST为10%。
*UST-镀层厚度标准板的容差(百分数表示)。大数情况下为±5%。
Rubber gasket / mask | Diameter | Measuring area | Measuring uncertainty* in percent of reading |
Rubber gasket B | 2,26 mm | 4mm2 | 6% |
Mask C | 1,13 mm | 1mm2 | 9% |
Mask D | 0,56 mm | 0.25mm2 | 20% |
* The specifications are based on calibration of GalvanoTest 3000 using ElektroPhysik thickness standards.
5. 其他参数
可测量超过70种涂层/基体组合,请参阅电解液选择表
Measurable coating/base combinations more than 70, please refer to the electrolyte selection table
溶解速度/De-plating speed:0.3~40mm/min
单位/Measuring unit:英制或公制(inches/μm)
厚度显示/ Display of readings:4位浮点读值/4-digits digital display with floating point 。
16位字母数字显示/ Alphanumerical display 16-digits :
显示仪器调整值,如金属,溶解速度等/display of instrument settings and operating steps。
指针表:监视溶解过程Analogue instrument for monitoring the de-plating process 。
数据存储/ Data memory:
18种不同金属选择,可存储2000个读值/max. 2,000 readings storable in a maximum of 18 application memories。
操作:按键/Operation via key pad
备用接口/Data ports :RS-232
电源Power supply:110V/220V±10% 50/60Hz /10W
重量/Weight:仪器/ instrument: 2.5Kg 测量支架/ precision holder: 2.5Kg
Galvanotest2000 3000电解膜厚仪设备技术规格书备件和消耗材料/Spare parts & expendables
1. 测量电镀件(铜、镍、铬等)相关电解液及电解头/Relative car plating thickness measure electrolyzing solution and measure head;
2. 标准配置/Standard supply
Galvanotest3000仪带模拟表、RS232C接口、内置循环泵的测量支架
-GalvanoTest 3000 processing unit
-interface for MiniPrint 4100 data printer or PC
-measuring stand 3000 with integrated circulation pump
I型含内部喷嘴的电解池/outer measuring cell and inner measuring cell, type I
2个密封垫 B型(4mm2) /2 rubber gaskets B (4,00 mm2)
2个用于C、D片的密封垫,直径1.5mm /2 rubber gaskets (.1,5mm) for sealing the masks
20片测量面封贴片/20 masks C (1,00 mm2)
20片测量面封贴片/20 masks D (0,25 mm2)
橡皮铅笔/rubber pencil
5 x100 ml可按客户要求的电解液/5 x100 ml electrolyte solution, a sorted to customer requirements
1个100 ml装使用过的废电解液的瓶子/1 bottle for used electrolyte solution, 100 ml
1个100 ml用于清洗电解池的喷雾瓶 /1 washing bottle, 100 ml
吸水纸1包/1 package absorbant paper
操作说明书1份 /operating instructions including works certificate
3. Galvanotest2000 3000电解膜厚仪设备技术规格书 推荐备件/Recommended accessories
使用不同电解液时的I型或II型内部喷嘴/inner measuring cell type I or II, for working with a second electrolyte solution
定位臂/ positioning arm
替换泵管/ spare pump tube
带连接电缆的电解液杯/ electrolyte cup incl. connecting cable
导线镀层测量夹/wire holder for measuring wires
小部件夹具/ small parts holder
7瓶100ml电解液的瓶架/ bottle stand for holding up to 7 electrolyte solution bottles, 100 ml each
校准板/coating thickness standards
用于5个内部喷嘴的测量支架/ measuring cell stand for holding up to 5 inner measuring cells
替换密封垫/spare rubber gaskets B (4 mm2)
封贴片/masks C (1 mm2)
封贴片/masks D (0.25 mm2)
定制密封垫/modified rubber gasket D/Au (0,25 mm2)
备用吸管/spare pipette
附加电解液/electrolyte selection
备用橡皮铅笔/spare rubber pencil
定心器/centering device (Z2)
打印机MINIPRINT 4000/ external accu battery powered data printer MiniPrint 4100
打印机MINIPRINT4000的连接电缆/ connecting cable for MiniPrint 4100 data printer
连接记录仪的电缆/connecting cable for writer
连接PC或兼容打印机的RS232电缆/ RS 232 connecting cable for PC or printer
MSoft7000数据传输程序/MSoft7000 data transfer program
附录:Galvanotest2000 3000电解膜厚仪设备技术规格书电解液(E)和镀层厚度标准(ST)选择/Elektrolyt selection table
Coating 底材 镀层 Substrate | Ag | Au | Cd | Cr | Cu | Brass | Ni | 化学镍Current-less Ni | Pb | Pb/Sn | Sn | Sn/Zn | Zn | |
银 | 金 | 镉 | 铬 | 铜 | 黄铜 | 镍 | 铅 | 铅/锡 | 锡 | 锡/锌 | 锌 | |
非金属 Non metal | E4 | | E5 | E11 | E4 | E4 | E14 | E17 | E15 | E4 | E7 | E7 | E6 | * |
| | 1 | 8 | | | | | | | | | | | | | | 8 | | 8 | | | | | | | ** | |
银 Ag | | | | | | | | | E15 | | | | | |
| | | | | | | | | | | | | | | | | 8 | | | | | | | | | |
铝 Al | E4 | | E5 | E11 | E4 | E4 | E14 | E17 | E15 | E4 | E11 | | E6 | |
8 | | | | 8 | | 8 | | 8 | | 8 | | 8 | | | 8 | | 8 | | 8 | | 8 | | | | 8 | |
青铜 Bronze | E8 | | | | | | | | | | E7 | | | |
8 | | | | | | | | | | | | | | | | | | | | | 8 | | | | | |
镉 Cd | | | | | | | | | | | E7 | | | |
| | | | | | | | | | | | | | | | | | | | | 8 | | | | | |
铜 Cu | E8 | | E5 | E7 | | | E14 | | E15 | E4 | E9 | E7 | E6 | |
| ST | 1 | 8 | | ST | | ST | | | | | | | ST | | | | | 8 | | 5 | ST | 8 | | ST | |
钢铁 Steel | E4 | | E5 | E11 | E4 | E4 | E14 | E17 | E15 | E4 | E7 | E7 | E20 | |
| ST | 8 | 8 | | ST | | ST | | ST | | | | | ST | | | 8 | | 8 | | | ST | 8 | | ST | |
黄铜 Brass | E8 | | E5 | E7 | E12 | | E14 | | E15 | E4 | E9 | E7 | E6 | |
| ST | 1 | 8 | | ST | | ST | 8 | | | | | | ST | | | 8 | | 8 | | 5 | ST | 8 | 5 | ST | |
镍 Ni | E8 | | E5 | E11 | E4 | E4 | | | E15 | | E7 | | E6 | |
8 | | 1 | 8 | 8 | | | ST | 8 | | 8 | | | | | | | 8 | | | | 8 | | | | 8 | |
硅 Si | | | | | | | E14 | | | | | | | |
| | | | | | | | | | | | 8 | | | | | | | | | | | | | | |
锌 Zn | | | | | E12 | | | | | | | | | |
| | | | | | | | 2 | ST | | | | | | | | | | | | | | | | | |
柯伐合金 Kovar | | | | | E4 | | | | E15 | | | | | |
| | | | | | | | 8 | | | | | | | | | 8 | | | | | | | | | |
镍-银 Ni-Ag | E8 | | | E7 | | | | | | | E7 | | | |
8 | | | | | | | | | | | | | | | | | | | | | 8 | | | | | |
铸锌 Cast Zn | | | | | E12 | | | | | | | | | |
| | | | | | | | 8 | | | | | | | | | | | | | | | | | | |
(1) 金镀层应客户要求而定 。
For electrolyte selection and instrument adjustment lease refer to our customer support.
(2) 见说明书9.8节(Cu/Zn) / See section 8.9 “Copper on Zinc” 。
(3) 见说明书9.9(锡/黄铜) / See section 8.10 “Tin on Brass” 。
(4) 适用于锡/锌,78%/22% / For Tin/Zinc 78%/22% 。
(5) 这种组合用II型电解池 / Please use the inner measuring cell type II 。
(8) 这种基底镀层组合需特别仔细,请与本公司联系。
Requires carefull measurement. Please contact our customer support if necessary .
(ST) 可供镀层厚度标准 /Coating thickness standards available on stock 。
涂装 相关仪器:涂层测厚仪,漆膜硬度测试仪,电解膜厚仪,黏度计/粘度计,X射线测厚仪,附着力测试仪,微型光泽仪,分光色差仪,雾影仪,反射率测定仪,光谱仪,涂膜干燥时间记录仪,标准光源箱